I-HDI ingaboni kwaye ingcwatywe ngeebhodi zesekethe isetyenziswe ngokubanzi kwiinkalo ezininzi ngenxa yeempawu zabo, ezifana nokuxinana kweengcingo eziphezulu kunye nokusebenza okungcono kombane. Ukusuka kwii-electronics zabathengi ezifana nee-smartphones kunye neepilisi ukuya kwizixhobo zemizi-mveliso ezineemfuno ezingqongqo zokusebenza ezifana ne-automotive electronics kunye nezikhululo ezisisiseko zonxibelelwano, i-HDI ingaboni kwaye ingcwatywe ngeebhodi zesekethe ibaluleke kakhulu, kunye nobubanzi bomgca kunye nokuchaneka kwezithuba zomgca, njengento ebalulekileyo echaphazela ukusebenza kwayo, inemigangatho engqongqo kunye eneenkcukacha.
一、 Ukubaluleka kobubanzi bomgca kunye nokuchaneka kwesithuba somgca
Impembelelo yokusebenza kombane: ububanzi bomgca buhambelana ngokuthe ngqo nokumelana nocingo, ukuchasana kobubanzi bomgca obanzi kuncinci, kunokuthwala ngoku ngakumbi; Umgama womgca uchaphazela i-capacitance kunye ne-inductance phakathi kwemigca. Kwisiphaluka esiphezulu se-frequency, ukuba ububanzi bomgca kunye nokuchaneka komgama wokuchaneka akwanelanga, ukutshintshwa kwe-capacitance kunye ne-inductance kuya kubangela ukulibaziseka kunye nokuphazamiseka kwinkqubo yokuhambisa umqondiso, echaphazela kakhulu ingqibelelo yesignali. Ngokomzekelo, kwi-HDI eyimfama engcwatywe ibhodi yesekethe ye-5G yezixhobo zonxibelelwano, izinga lokudluliselwa kwesignali liphezulu kakhulu, kwaye umgca omncinci wobubanzi kunye nokuphambuka komgama womgca kungenza ukuba umqondiso awukwazi ukuhanjiswa ngokuchanekileyo, okubangelwa ukuhla komgangatho wonxibelelwano.
Uxinaniso lweengcingo kunye nokusetyenziswa kwendawo: Enye yeenzuzo ze-HDI iibhodi zesekethe ezingaboniyo zingcwatywe yi-high-density wiring. Ububanzi bomgca obuchanekileyo kunye nomgca wokuqhawula umgca unokucwangcisa imigca emininzi kwindawo elinganiselweyo ukufezekisa imisebenzi enzima yesekethe. Ukuthatha i-motherboard ye-smartphone njengomzekelo, ukwenzela ukuba kuhlaliswe inani elikhulu lee-chips, izinzwa kunye nezinye izinto ze-elektroniki, inani elikhulu le-wiring kufuneka ligqitywe kwindawo encinci kakhulu. Kuphela ngokulawula ngokungqongqo ububanzi bomgca kunye nokuchaneka komgama womgca sinokufikelela kwi-wiring esebenzayo kwindawo encinci, siphucule ukudityaniswa kwe-motherboard, kwaye sihlangabezane neemfuno ezityebileyo zeefowuni eziphathwayo.
二、Ixabiso eliqhelekileyo eliqhelekileyo lobubanzi bomgca kunye nokuchaneka komgama womgca
Umgangatho jikelele weshishini: Kwibhodi yokwenziwa kwebhodi yesekethe yomngxuma oyimfama weHDI jikelele, obona bubanzi buphantsi bomgca oqhelekileyo bunokufikelela kwi-3-4mil (0.076-0.10mm), kwaye umgama womgca osezantsi ukwamalunga ne-3-4mil. Kwezinye iimeko zezicelo ezingabizi kakhulu, ezifana neebhodi zolawulo ezingezizo ezingundoqo kwizinto zombane eziqhelekileyo zabathengi, ububanzi bomgca kunye nesithuba somgca sinokunyenyiswa ukuya ku-5-6mil (0.127-0.152mm). Nangona kunjalo, kunye nenkqubela phambili yeteknoloji, ububanzi bomgca kunye nokuchaneka komgama weebhodi zeesekethe eziphezulu ze-HDI ziphuhliswa kwindlela encinci. Ngokomzekelo, ezinye ii-substrates zokupakisha i-chip, ububanzi bomgca wabo kunye nomgama womgca ufikelele kwi-1-2mil (0.025-0.051mm) ukuhlangabezana neemfuno zokuhambisa umqondiso we-speed-speed and high-density-high-density in the chip.
Umahluko osemgangathweni kwiindawo ezahlukeneyo zesicelo: Kwintsimi ye-elektroniki yeemoto, ngenxa yeemfuno eziphezulu zokuthembeka kunye nemeko yokusebenza entsonkothileyo (ezifana nobushushu obuphezulu, ukungcangcazela okuphezulu, njl. njl.), Ububanzi bomgca kunye nemigangatho yokuchaneka komgama we-HDI iibhodi zesekethe ezingaboniyo zingqongqo ngakumbi. Ngokomzekelo, ibhodi yesiphaluka esetyenziswe kwiyunithi yokulawula injini yemoto (ECU), ububanzi bomgca kunye nokuchaneka komgama wokuchaneka ngokuqhelekileyo kulawulwa kwi-4-5mil ukuqinisekisa ukuzinza nokuthembeka kokuhanjiswa komqondiso kwiindawo ezinzima. Kwinkalo yezixhobo zonyango, ezifana nebhodi yesiphaluka se-HDI kwi-imaging resonance imaging (MRI) izixhobo, ukwenzela ukuba kuqinisekiswe ukufunyanwa kwesignali echanekileyo kunye nokucubungula, ububanzi bomgca kunye nomgca wokuchaneka komgama unokufikelela kwi-2-3mil, ebeka iimfuno eziphezulu kakhulu kwinkqubo yokuvelisa.
三、 Izinto ezichaphazela ububanzi bomgca kunye nokuchaneka komgama womgca
Inkqubo yokuvelisa: inkqubo ye-lithography yikhonkco eliphambili lokumisela ububanzi bomgca kunye nokuchaneka komgama womgca. Kwinkqubo ye-lithography, ukuchaneka komatshini wokuvezwa, ukusebenza kwe-photoresist kunye nokulawulwa kwenkqubo yophuhliso kunye ne-etching kuya kuchaphazela ububanzi bomgca kunye nomgama womgca. Ukuba ukuchaneka komatshini wokuvezwa akwanelanga, ipateni yokuvezwa inokuthi ibe necala, kwaye ububanzi bomgca kunye nomgama womgca emva kokudibanisa kuya kuphambuka kwixabiso loyilo. Kwinkqubo ye-etching, ulawulo olungafanelekanga loxinaniso, ubushushu kunye nexesha le-etching ye-etching liquid iya kubangela iingxaki ezifana nobubanzi obukhulu kakhulu okanye ububanzi bomgca omxinwa kakhulu kunye nomgama womgca ongalinganiyo.
Iimpawu zezinto eziphathekayo: I-substrate ye-substrate kunye neempawu ze-foil zobhedu zebhodi yesiphaluka nazo zinefuthe kububanzi bomgca kunye nokuchaneka komgama womgca. I-coefficient yokwandisa i-thermal yezinto ezahlukeneyo ze-substrate zihluke. Kwinkqubo yokuvelisa, ngenxa yeenkqubo ezininzi zokufudumeza kunye nokupholisa, ukuba i-coefficient yokwandisa i-thermal ye-substrate material ayizinzile, inokukhokelela ekuguqulweni kwebhodi yesiphaluka, echaphazela ububanzi bomgca kunye nokuchaneka komgama womgca. Ubukhulu obufanayo befoyile yobhedu bukwabalulekile, kwaye isantya sokufakwa kwefoyile yobhedu enobungqingqwa obungalinganiyo siya kuba singahambelani ngexesha lenkqubo yokubhala, okukhokelela ekutenxeni kobubanzi bomgca.
四, Iindlela zokubona nokulawula ukuchaneka
Ukufumanisa kuthetha: Kwinkqubo yokuvelisa ibhodi yesekethe ye-HDI eyimfama engcwatywe umngxuma, iindlela ezahlukeneyo zokufumanisa ziya kusetyenziswa ukujonga ububanzi bomgca kunye nokuchaneka komgama womgca. Imakroskopu ye-Optical sesinye sezixhobo ezisetyenziswa ngokuqhelekileyo zokuhlola. Ngokukhulisa umfanekiso womphezulu webhodi yesekethe, ububanzi bomgca kunye nomgama womgca ulinganiswa ngesandla okanye ngoncedo lwesofthiwe yokuhlalutya umfanekiso ukujonga ukuba umgangatho udibene. I-electron